Systems, devices and methods for analyzing and processing samples

ABSTRACT

An example embodiment may include a hyperspectral analyzation subassembly configured to obtain information for a sample. The hyperspectral analyzation subassembly may include one or more transmitters configured to generate electromagnetic radiation electromagnetically coupled to the sample, one or more sensors configured to detect electromagnetic radiation electromagnetically coupled to the sample, and an electromagnetically transmissive window. At least one of the sensors may be configured to detect electromagnetic radiation from the sample via the window. The hyperspectral analyzation subassembly may include an analyzation actuation subassembly configured to actuate at least a portion of the hyperspectral analyzation subassembly in one or more directions of movement with respect to the sample.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional of U.S. application Ser. No. 15/006,681, filed on Jan. 26, 2016, which claims the benefit under 35 U.S.C. §119(e) of U.S. Provisional Application No. 62/108,003, filed on Jan. 26, 2015, each of which is incorporated by reference in its entirety.

BACKGROUND

The present disclosure generally relates to systems, devices and methods for analyzing and processing samples. Information about the samples may be obtained through a variety of analysis techniques such as microscopy, spectroscopy, spectrometry, chromatography, as well as many others. Information about the samples may be used to conduct experiments; improve, control or monitor production processes; or improve, control or monitor manufactured products.

The claimed subject matter is not limited to embodiments that solve any disadvantages or that operate only in environments such as those described above. This background is only provided to illustrate examples of where the present disclosure may be utilized.

SUMMARY

The present disclosure generally relates to systems, devices and methods for analyzing and processing samples or analytes. Information about the samples may be obtained through a variety of analysis techniques such as microscopy, spectroscopy, spectrometry, chromatography, as well as many others. Information about the samples may be used to conduct experiments; improve, control or monitor production processes; or improve, control or monitor manufactured products.

In an example configuration, a hyperspectral analyzation subassembly may include one or more transmitters configured to generate electromagnetic radiation electromagnetically coupled to the sample, one or more sensors configured to detect electromagnetic radiation electromagnetically coupled to the sample, and an electromagnetically transmissive window. At least one of the sensors may be configured to detect electromagnetic radiation from the sample via the window. The hyperspectrical analyzation subassembly may include an analyzation actuation subassembly configured to actuate at least a portion of the hyperspectrical analyzation subassembly in one or more directions of movement with respect to the sample.

This Summary introduces a selection of concepts in a simplified form that are further described below in the Detailed Description. This Summary is not intended to identify key features or essential characteristics of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic diagram of a non-limiting embodiment of a system configured to analyze or process samples.

FIGS. 2A-2B are perspective views of a non-limiting embodiment of a system configured to analyze or process samples.

FIGS. 2C-2E are perspective views of a portion of the system of FIGS. 2A-2B.

FIGS. 3A-3D are perspective views of a head assembly of the system of FIGS. 2A-2B.

FIGS. 3E-3F are perspective views of a portion of the head assembly of FIGS. 3A-3D.

FIGS. 4A-4B are perspective views of an interface assembly of the system of FIGS. 2A-2B.

FIGS. 5A-5B are perspective views of a portion of the interface assembly of FIGS. 4A-4B.

FIG. 5C is a cross-sectional view of the interface assembly of FIGS. 4A-4B.

FIG. 6A is a perspective view of a non-limiting embodiment of the system of FIGS. 2A-2B with a device configured to analyze one or more samples positioned in a sample tray.

FIG. 6B is a perspective view of a non-limiting embodiment of the system of FIGS. 2A-2B with a device configured to analyze layers of samples.

FIG. 6C is a perspective view of a non-limiting embodiment of the system of FIGS. 2A-2B with a device configured to analyze granular samples.

FIG. 7A is a perspective view of the non-limiting embodiment of the device of FIG. 6A.

FIG. 7B is a perspective view of a portion of the device of FIG. 7A.

FIG. 7C is another perspective view of the device of FIG. 7A.

FIG. 7D is a top view of the device of FIG. 7A.

FIGS. 8A-8D are representations of scanning methods of the system of FIGS. 2A-2B.

FIG. 9 illustrates an example configuration of a method.

FIGS. 10A-10B illustrate perspective views of a non-limiting embodiment of a device configured to analyze fluid samples.

FIG. 10C is a side section view of the device of FIGS. 10A-10B.

FIG. 10D is a side section view of a portion of the device of FIGS. 10A-10B.

FIG. 10E is a schematic diagram of an example configuration of the device of FIGS. 10A-10B.

FIG. 10F is a schematic diagram of a portion of the example configuration of FIG. 10E.

FIGS. 11A-11B are perspective views of non-limiting embodiments of systems that may be configured to be used as a part of production line to analyze and process samples.

FIG. 12A is a schematic diagram of an analysis configuration that may be used in immersion microscopy.

FIGS. 12B-12D are schematic diagrams of another analysis configuration that may be used in immersion microscopy.

FIGS. 12E-12G are schematic diagrams of other analysis configurations.

FIGS. 12H-12J illustrate a non-limiting embodiment of an array.

DETAILED DESCRIPTION

Reference will be made to the drawings and specific language will be used to describe various aspects of the disclosure. Using the drawings and description in this manner should not be construed as limiting the scope of the disclosure. Additional aspects may be apparent in light of the disclosure, including the claims, or may be learned by practice. The drawings are non-limiting, diagrammatic, and schematic representations of example embodiments, and are not necessarily drawn to scale.

The terms and words used in the following description and claims are not limited to the bibliographical meanings, but, are merely used to enable a clear and consistent understanding of the disclosure. It is to be understood that the singular forms “a,” “an,” and “the” include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to “a component surface” includes reference to one or more of such surfaces.

By the term “substantially” it is meant that the recited characteristic, parameter, or value need not be achieved exactly, but that deviations or variations, including for example, tolerances, measurement error, measurement accuracy limitations and other factors known to those skilled in the art, may occur in amounts that do not preclude the effect the characteristic was intended to provide.

The term “granular sample” may include single crystalline particles, polycrystalline particles, granulated particles, granulated multicomponent particles, micronized particles, single component or blended substances, or any combination thereof. In some aspects, “granular sample” may include any powdered sample.

The term “analyte” may refer to a substance whose physical and/or chemical constituents are to be analyzed, identified and/or measured.

The terms “assembly” or “subassembly” may be used interchangeably to refer to any portion of a device or system as may be indicated by context, and may refer to different portions of a device or system when used in different contexts.

The term “vacuum” may refer to a pressure differential in a system or a portion of a system. The term “vacuum” may include a positive or negative pressure differential. In some aspects, the term “vacuum” may refer to systems or portions of systems with an internal pressure less than or greater than atmospheric pressure.

The present disclosure generally relates to systems, devices and methods for analyzing and processing samples. The disclosed systems may include modular aspects that permit the systems to be configured to analyze or process different types of samples, which may referred to as analytes. Additionally or alternatively, the systems may include modular aspects to permit the systems to be configured to analyze or process samples by one or more different methods or techniques. Information about the samples may be obtained through a variety of analysis techniques such as microscopy, spectroscopy, spectrometry, chromatography, as well as many others. Information about the samples may be used to conduct experiments; improve, control, or monitor production processes; or improve, control, or monitor manufactured products.

In some configurations, the disclosed systems may be used in a lab setting to conduct experiments. For example, the configuration of the systems may be selected for powders, liquids, gases, emulsions, suspensions, solids, homogeneous combinations, heterogeneous combinations, pills, tablets, materials, biological samples, and/or any suitable combinations thereof.

In other configurations, the disclosed systems may be used as a part of production line to analyze and process samples to obtain information about aspects of the production line, such as characteristics of finished products and/or of intermediaries of the products. The disclosed systems may be implemented as in-process monitoring systems integrated into a production line and configured to analyze one or more properties of a sample as it is being produced.

FIG. 1 is a schematic diagram of an example embodiment of a system 10 that may be configured to analyze or process samples. The system 10 may include an objective 12 optically coupled to an optical multiplexer 14. The optical multiplexer 14 may be optically coupled to a sensor 16, an emitter 18 and/or a detector 20. A sample 34 may be positioned on and/or over a window 30 that is optically coupled to the objective 12 and/or the optical multiplexer 14. The system 10 may include a platform 22 that may be configured to move portions of the system 10 relative to the sample 34. In some configurations, the platform 22 may be configured to move portions of the system 10 in three directions of movement (linear, non-linear, angular, etc.). At least some portions of the system 10 can be translated in any of the three directions relative to the sample 34. In operation, the movement of the platform 22 may contribute to focusing optical components of the system 10, scanning the sample 34, engaging or disengaging portions of the system 10, and/or a combination thereof.

The emitter 18 may be configured to emit radiation to analyze the sample 34. The emitter may emit any suitable electromagnetic radiation to analyze and/or process the sample 34. For example, the emitter 18 may emit visible light, ultraviolet light, X-rays, infrared or any other suitable radiation. In some configurations, the emitter 18 may be a laser or diode. In some configurations, the emitter 18 may be a Raman laser source. In some configurations, the emitter 18 may be optically coupled to an optically fiber to transmit and/or guide electromagnetic radiation toward the sample 34.

The detector 20 may be configured to detect radiation from the sample 34. For example, the detector 20 may be configured to detect radiation from the sample 34 resulting from the radiation from the emitter 18 incidenting the sample 34. The detected radiation may permit information regarding the sample 34 to be obtained. In some configurations, the detector 20 may be a Raman spectrometer. In some configurations, the detector 20 may be optically coupled to an optically fiber to transmit and/or guide electromagnetic radiation from the sample 34 to the detector 20.

An emitter 32 may be positioned around the window 30 and/or proximate the sample 34 and configured to emit radiation that may incident the sample 34. In some configurations, the emitter 32 may be a ring encircling the window 30. In other configurations, the emitter 32 may be one or more discrete emitter elements positioned at various suitable positions with respect to the window 30 and/or the sample 34. In some configurations, the emitter 32 may be an electromagnetic radiation source or an electromagnetic radiation ring.

In some configurations, the system 10 may include a controller 28 configured to control the operation of at least a portion of the system 10. The controller 28 may include a processor 24 that executes instructions stored in memory 26. The processor 24 and memory 26 can be incorporated into the system 10, as illustrated. In other configurations, the processor 24 and/or the memory 26 can be located in a controller 28 external to the system 10. For example, the system 10 may be controlled and/or operated by a computer system coupled to the system 10.

The memory 26 can include executable instructions that control the operation of the system 10. For example, the memory 26 can comprise instructions that when executed by the processor 24 causes the emitter 32 to expose the sample 34 to emitted radiation (e.g., electromagnetic, visible light, ultraviolet, heat, microwave, or other radiation). Depending on the properties of the sample 34 and the characteristics of the emitted radiation, some of the radiation projected on the sample 34 may pass through the sample 34, some may be absorbed by the sample 34, and/or some may be reflected by the sample 34.

Emissions from the irradiated sample 34 (for example, by reflection or fluorescence), may travel through the objective 12 into the optical multiplexer 14. At least a part of the emissions from the sample 34 may be directed to the sensor 16 by the optical multiplexer 14. The sensor 16 may detect characteristics of the received radiation, such as energy level, wavelength, or other characteristics. The characteristics of the received radiation may be used to determine characteristics of the sample 34. For example, in some configurations, the characteristics of the received radiation may be used to determine aspects of the sample 34.

The system 10 may be configured to use the sensor 16 to obtain information about the sample 34. For example, the sensor 16 may be an image sensor (e.g., a color camera, or monochromatic camera) configured to obtain images of the irradiated sample 34. The controller 28 may be configured to receive, process, modulate, and/or convert signals from the sensor 16 to obtain information about the sample 34. In some configurations, the controller 28 may be configured to generate images of the sample 34 from the signals from the sensor 16. The controller 28 can employ image analyzing algorithms to: (i) compare particle luminance magnitude of the sample 34; (ii) detect particle sizes of the sample 34; (iii) compare particle sizes against other sizes in the sample 34 or to a database of particle sizes; (iv) compare particle sizes against other shapes in the sample 34 or to databases of particle shapes, and/or any suitable combinations of these algorithms or others.

In some configurations, the emitter 32 emits electromagnetic radiation at a given wavelength of a plurality of wavelengths into the sample 34. The emitter 32 may include, for example, one or more emitters capable of producing electromagnetic radiation within a terahertz range. In another example, a wavelength of the electromagnetic radiation may be within a range of approximately 0.01 to 10 nanometers. This range comprises X-ray wavelengths. In yet another example, the electromagnetic radiation produced by the emitter 32 may be varied in wavelength from blue to ultraviolet light. In another example, the emitter 32 emits white light. The responsiveness of the sample 34 is determined by the controller 28 by examining color of the one or more of the components of the sample 34.

The emitter 32 may be multiple sources that each provides a unique narrow band wavelength of electromagnetic radiation. For example, each of the emitters 32 may output any of red, blue, and green light. The emitters 32 may include light emitting diodes and/or lasers.

In yet other configuration, the emitter 32 may expose the mixture sample to near infrared or mid infrared light. The emitters 32 may produce broad band radiation or successive bursts of narrow bands of radiation. In one example, the emitters 32 may selectively expose the mixture sample to many different wavelengths of electromagnetic radiation and analyzing how each wavelength affects components of the sample 34. This example configuration may be used to analyze samples of unknown composition, although other configurations are contemplated.

The objective 12 may include a high, low, or variable magnification objective lens. The objective 12 may include a high magnification lens that permits viewing of small particles (e.g., less than 20 microns in size) and/or viewing small features on larger particles. The objective 12 may include low magnification lenses used to provide a large field of view, which may permit rapid identification of regions of interest in an image. The magnification of the objective 12 may be selectively varied by the controller 28 to locate particles at low power settings. The controller 28 may be configured execute analytical processes to identify the particle by shape and/or size. The controller 28 may be configured to zoom in where particles of certain characteristics are identified.

In some configurations, an optical filter may be optically coupled prior to the sensor 16 to block frequencies of radiation that may damage the sensor 16 and/or provide undesired effects on the information obtained by the sensor 16. In some configurations, the optical filter may be selected depending on the wavelength of the electromagnetic radiation that is output by the emitter 32. In some configurations, the optical filter may be configured to block light at wavelengths of approximately 425 nanometers to 700 nanometers. In other configurations, higher wavelength filters may be used in combination with lower wavelength filters. For example, higher wavelength filters may be used, for example, with Raman lasers, while lower wavelength filters may be used with, for example, ultraviolet light. In some configurations, the emitter 32 may be a laser optically coupled with a long pass filter. In another example, the emitter 32 may be a light emitting diode (LED) optically coupled to a long pass filter.

The system 10 may include one or more optical filters used to block the excitation wavelength for the sensor 16 to permit the sensor 16 to obtain usable images. The controller 28 may be configured to activate the emitter 32 for a set period of time, such as ten seconds. Images may be captured of the sample 34 by the sensor 16 to determine the responsiveness of at least portions of the sample 34 by detecting timing and decay of response of the one or more of the components of the sample 34 to the radiation.

The system 10 may use additional measurement algorithms to detect and differentiate components of the sample 34 from one another using particle size and shape. For example, the controller 28 of the system 40 can use various image processing methods to determine an aspect ratio for particles of components of the sample 34. Also, the controller 28 of the system 10 can calculate size, shape, fuzziness, angularity, brightness, and combinations thereof for components of the sample 34.

The size and/or shape of components of the sample 34 may be used to detect the presence of paper fibers or other contaminates. For example, if a particle is detected, its size and shape may be calculated using image processing. The size and shape may be compared to a database of particle sizes and corresponding shapes. If no reasonable comparison is found, a particle may be determined to be a contaminate. Contaminates may be catalogued and/or stored in a database. In some configurations of the system 10, contaminants may be isolated, concentrated, separated, stored, and/or disposed. The algorithm used by the controller 28 may be selected based on the composition of the sample 34, if an expected composition for the sample 34 is known.

With continued reference to FIG. 1, the emitter 32 may emit electromagnetic radiation into the mixture sample at an angle B that is specified with reference to a central axis C of the window 30. In such configurations, radiation may enter the sample 34 at the angle B.

The controller 28 may be configured to detect, track and/or count a number of excited particles in the sample 34. The controller 28 may be further configured to calculate a concentration of a selected component of the sample 34. For example, when the controller 28 has located a number of a first component of the sample 34, the controller 28 may calculate a volume of the first component of the sample 34, for example, using image analysis. The overall area of the particles of the first component relative to the total area of the image may be used to estimate the volume by weight of the first component, if the size of the first component particles is known.

In some configurations, Raman spectroscopy may be used to verify and/or analyze the presence, size, and/or shape of components of the sample 34. In such configurations, the emitter 18 may be a Raman laser source and the detector 20 may be a Raman spectrometer. The emitter 18 may be controlled, for example, by the controller 28 to expose the sample 34 to a wavelength of laser light. The laser light may be focused onto a small portion of the sample 34 where candidate particles are fluorescing (e.g., responsive). Images may be transferred by the optical multiplexer 14 to the Raman spectrometer detector 20 via a Raman spectrometer interface. The Raman spectrometer detector 20 and or the Raman spectrometer interface may be integrated into the system 10 or may be a standalone external feature. In some circumstances, the identification of the candidate particles may be confirmed using Raman spectroscopy.

In other configurations, the emitter 18 may instead be an X-ray source, near infrared source, infrared source, ultra violet source, and/or any source of radiation suitable for an intended application. The system 10 may include any suitable combinations or permutations of these or other radiation sources, depending on the type of analytes being analyzed and/or the desired information to be obtained.

In some configurations, the system 10 may be used to obtain three-dimensional models of the sample 34. A three dimensional model may be a composition of many images obtained using permutations of positions in three axes X, Y, and Z. For example, the objective 12 may be moved in three directions of movement along three axes X, Y, and Z by the platform 22. The Z-axis may be aligned with the central axis C of the window 30. Depending on the width of the field of view of the sensor 16, the objective 12 may be moved sequentially along the window 30 in the X and Y direction. At each X and Y location, the platform 22 may translate the objective 12 from an initial position along the Z-axis towards the window 30, in increments (e.g., one micron increments, etc.). At each increment, the sensor 16 may obtain an image of the illuminated sample 34. The system 10 may be capable of obtaining images at any given depth into the sample 34. These images may each be associated with their respective X, Y, and Z location information. The images may be assembled together by the system 10, for example via the controller 28, to form a three-dimensional model of the sample 34.

The three-dimensional imaging of the sample 34 may be used to calculate responsive particles of a component of the sample 34 on a surface of the sample 34, as well as particles located within the sample 34 at a specified distance inside the surface of the sample 34.

A method of analyzing the sample 34 using the system 10 will be described in further detail. The method may include capturing high resolution color images of the sample 34 exposed with multiple color lighting (e.g., a range of wavelengths of electromagnetic radiation). The multiple color lighting of the sample 34 may occur at multiple angles of incidence and/or from different directions. For example, the angle B may be selectively varied during illumination of the sample 34. The method may include processing the images to identify possible particles of a first component of the sample 34 by size, color, and/or shape. The method may include using Raman scanning and analysis to positively identify candidate particles as particles of the first component. This may be accomplished using a Raman signature for particles of the first component as a baseline. The method may include calculating a particle area to percentage-by-weight calculation where a percentage-by-weight is correlated to a percentage-by-area of particles of the first component observed in the images. The method may be repeated until a statistically significant particle area is located in one or more components of the sample 34 and/or multiple samples.

The system 10 may include any suitable aspects described in U.S. patent application Ser. No. 14/507,637, entitled “OPTICAL AND CHEMICAL ANALYTICAL SYSTEMS AND METHODS” and U.S. patent application Ser. No. 14/454,483, entitled “ANALYSIS AND PURGING OF MATERIALS IN MANUFACTURING PROCESSES,” which are both incorporated herein by reference in their entirety and for all purposes. The concepts described with respect to the system 10 may be implemented in a variety of configurations and may be combined with other aspects of this disclosure, as may be indicated by context.

Turning to FIGS. 2A-2E, an example embodiment of a system 40 that can be configured to analyze or process samples will be described. In some configurations, the system 40 may be an implementation of the system 10 of FIG. 1. Accordingly, the system 40 may include any suitable aspects described with respect to system 10, as may be indicated by context.

FIGS. 2A and 2B are perspective views of a portion of the system 40. As illustrated, the system 40 may include a housing 42 surrounding at least a portion of the system 40. The system 40 may include an interface assembly 80 configured to interface with other portions of the system 40, as will be described in further detail below. The interface assembly 80 may include a body 82 and a window 84 that is configured to permit light to travel through at least a portion of the interface assembly 80. The window 84 may be at least partially transparent or translucent and/or may be configured to convey, direct, collimate and/or focus light travelling through the interface assembly 80. In the illustrated configuration, the interface assembly 80 is positioned on a top portion of the housing 42, although other suitable configurations are contemplated.

Turning to FIG. 2B, the system 40 may include a first connector 44, a second connector 46, and a third connector 48 connecting portions of the system 40 inside of the housing 42 to portions of the system 40 exterior to the housing 42. The connectors 44, 46, and 48 may be electronic connectors configured to transmit data, power and/or control signals. The system 40 may include a switch 52 that may be configured to activate and/or turn on at least portions of the system 40.

As illustrated, the first connector 44 may be a socket configured to receive a first plug to electrically couple the system 40 and the second connector 46 may be a socket configured to receive a second plug to electrically couple the system 40. The first connector 44 may permit the system 40 to be electrically coupled to a power source, for example, an alternating current (AC) power supply. The second connector 46 may be a socket configured to transmit data, power and/or control signals in and/or out of portions of the system 40 inside of the housing 42.

As illustrated, the third connector 48 may be a cable connector coupled with the housing 42 by a connector panel 50. In the illustrated configuration, the third connector 48 is a Universal Serial Bus (USB) cable extending from the system 40. In such configurations, the third connector 48 may transmit one or more of data, power and/or control signals. In other configurations, the third connector 48 may be any suitable connector that may or may not correspond to an interface standard or interface protocol (such as USB, firewire, etc.). The connector panel 50 may include a connector 51 which may be, for example, a fluid connector or a vacuum connector.

In some configurations, the third connector 48 may permit the system 40 to be coupled to electronic components such as computers, computer systems, computer interfaces, user interfaces, mobile devices and/or any other suitable electronic component. In such configurations, the electronic component may provide power and/or control signals to the system 40 via the third connector 48. Additionally or alternatively, the electronic component may receive data signals and/or feedback from the system 40 via the third connector 48. In other configurations, the third connector 48 may permit the system 40 to be coupled to other components of the system 40. In such configurations, portions of the system 40 (for example, portions inside of the housing 42) may provide power and/or control signals to at least one other component of the system 40 via the third connector 48. Additionally or alternatively, portions of the system 40 (for example, portions inside of the housing 42) may receive data signals and/or feedback from at least one other component of the system 40 via the third connector 48. The connector panel 50 may be removably coupled to the housing 42 to permit connectors of different types to be coupled to the system 40.

In some configurations, the system 40 may include non-illustrated connectors such as a fluid connector configured to permit fluid (gaseous, liquid, or otherwise) to travel into or out of the housing 42. Fluid connectors may permit the system 40 to be coupled with, for example, vacuum lines, pressurized gas lines, cooling fluid lines, water lines, liquid lines, or other suitable fluids. Although the illustrated configuration includes three connectors 44, 46, and 48, the system 40 may include any suitable amount of connectors and may include connectors of any suitable type. The configurations of the connectors may be selected based on the desired configuration and/or functionality of the system 40, as applicable. Additionally or alternatively, the configuration of the connectors may be selected depending on modular components that may be coupled, added and/or activated with the system 40.

The system 40 may include a security assembly 54 that may be configured to lock the system 40 from being operated. For example, the security assembly 54 may disable portions of the system 40 such as emitters from operating to facilitate in preventing inadvertent exposure to electromagnetic radiation. In some configurations, the security assembly 54 may disconnect power from one or more emitters of the system 40. The security assembly 54 may facilitate in preventing operation of the system 40 in a potentially unsafe manner and/or may facilitate in preventing inadvertent exposure to electromagnetic radiation when the system 40 is being serviced. In the illustrated configuration, the security assembly 54 is a key and a lock configured to receive the key. In other configurations, the security assembly 54 may include any suitable electronic and/or mechanical locking mechanism. For example, biometric and/or cryptographic key locking mechanisms (password, passphrase, personal identification number, etc.) may be employed. The security assembly 54 may facilitate safe operation of the system 40 by permitting only qualified users to operate the system 40.

The system 40 may include a temperature management assembly 56 configured to facilitate temperature control of at least a portion of the system 40. For example, the temperature management assembly 56 may heat or cool portions of the system 40, such as those positioned within the housing 42, to maintain desired or suitable operating conditions. As illustrated for example in FIG. 2E, in some configurations the temperature management assembly 56 may include a heat sink 36 positioned between a first ventilator 38 and a second ventilator 58. The heat sink 36 may be configured to transmit heat by conduction and maintain separation between the interior and the exterior of the housing 42. The first ventilator 38 and second ventilator 58 may be configured to drive air and/or other fluids along the surfaces of the heat sink 36 to facilitate heat management. In other configurations, the temperature management assembly 56 may include any suitable heating and/or cooling mechanisms.

Although in the illustrated configuration components of the system 40 such as the switch 52, the security assembly 54, the temperature management assembly 56, and the connectors 44, 46, 48 are positioned on one end of the housing 42, such components may be positioned at any suitable position in the system 40. In some configurations, at least one of the components may be positioned, for example, inside of the housing.

FIGS. 2C, 2D, and 2E illustrate portions of the system 40 inside of the housing 42, which is represented by dashed lines. As illustrated, the system 40 may include a head assembly 70, a power assembly 60, an emitter assembly 62, a detector assembly 64, and an electronic assembly 66 positioned inside of the housing 42. The head assembly 70 may be mechanically coupled to the interface assembly 80 and/or optically coupled to receive and/or transmit electromagnetic radiation to/from the interface assembly 80. The head assembly 70 is omitted from FIG. 2E to illustrate other portions of the system 40.

The power assembly 60 may be configured to control, distribute and/or modulate power supplied to portions of the system 40. In some configurations, the power assembly 60 may be electrically coupled with various portions of the system 40 by electrical couplings such as cables (not illustrated).

The emitter assembly 62 may include an emitter such as the emitter 18 and the detector assembly 64 may include a detector such as detector 20 as described with respect to FIG. 1. The emitter assembly 62 may include a first interface 72 and the detector assembly 64 may include a second interface 74. In some configurations, the first and second interfaces 72, 74 may be optical interfaces configured to optically couple the emitter assembly 62 and/or the detector assembly 64. For example, the first interface 72 may optically couple the emitter assembly 62 to the head assembly 70 via, for example, an optical cable (not illustrated). In another example, the second interface 74 may optically couple the detector assembly 64 to the head assembly 70 via, for example, an optical cable (not illustrated). The emitter assembly 62 may be configured to transmit radiation to the head assembly 70 and/or the detector assembly 64 may be configured to receive radiation from the head assembly 70 to obtain information about samples. In some configurations, the emitter assembly 62 may be a Raman laser source assembly and the detector 20 may be a Raman spectrometer assembly.

In some configurations, portions of the system 40 may be optically coupled to one another with optical fibers configured to transmit electromagnetic radiation between different portions of the system 40.

In an example implementation, the head assembly 70 may include an objective, an optical multiplexer, a sensor and/or platform such as the objective 12, the optical multiplexer 14, the sensor 16, and/or platform 22 as described with respect to FIG. 1. Additionally or alternatively, the head assembly 70 may include a controller such as controller 28 as described with respect to FIG. 1. The head assembly 70 will be described in further detail below with respect to FIGS. 3A-3F.

The electronic assembly 66 may be configured to distribute data, power and/or control signals to various portions of the system 40. The electronic assembly 66 may include one or more connectors 76, 78 configured to couple various components of the system 40. In some configurations, the electronic assembly 66 may be a USB hub.

FIGS. 3A-3D illustrate perspective views of an example implementation of the head assembly, denoted generally at 70. FIGS. 3E and 3F illustrate the head assembly 70 with some portions omitted to illustrate other details of the head assembly 70. As illustrated, the head assembly 70 may be optically coupled to receive and/or transmit electromagnetic radiation to/from the interface assembly 80. Specifically, the head assembly 70 may include an objective 102 (see for example FIGS. 3E and 3F) coupled to the interface assembly 80. The objective 102 may include optics configured to convey, direct, collimate and/or focus electromagnetic radiation travelling between the head assembly 70 and the interface assembly 80. As illustrated for example in FIG. 3F, the objective 102 may be optically coupled to an optical multiplexer 104. The optical multiplexer 104 may be configured to distribute electromagnetic radiation travelling through the head assembly 70 and/or other portions of the system 40. Additionally or alternatively, the optical multiplexer 104 may be configured to convey, direct, collimate and/or focus electromagnetic radiation travelling through the head assembly 70 and/or other portions of the system 40.

The head assembly 70 may include a sensor 106 configured to detect characteristics of received electromagnetic radiation such as energy level, wavelength, or other characteristics (for example, as described above with respect to the system 10). The characteristics of the received radiation may be used to determine characteristics of samples. In some configurations, the sensor 106 may be an image sensor (e.g., a color camera, or monochromatic camera) configured to obtain images of samples. An optical assembly 108 may be optically coupled between the optical multiplexer 104 and the sensor 106. The optical assembly 108 may be configured to convey, direct, collimate and/or focus electromagnetic radiation travelling between the optical multiplexer 104 and the sensor 106. The sensor 106 may include a first connector 110 and/or a second connector 112 configured to transmit data, power and/or control signals between the sensor 106 and other portions of the head assembly 70.

The head assembly 70 may be configured such that portions of the head assembly 70 may be moved with respect to the interface assembly 80. For example, in some configurations, the head assembly 70 may move at least the objective 102 with respect to the interface assembly 80. In some configurations, the head assembly 70 may be configured to move portions of the head assembly 70 in three directions of movement (linear, non-linear, angular, etc.), for example, along three axes: X, Y, and Z. In operation, the movement of portions of the head assembly 70 such as the objective 102 may contribute to focusing and/or scanning the samples.

As illustrated for example in FIG. 3E, the head assembly 70 may include one or more motors or actuators 160, 170, 180. Each of the actuators 160, 170, 180 may be coupled to a corresponding slide 162, 172, 172 configured to the permit portions of the head assembly 70 (e.g., the objective 102) to move with respect to the interface assembly 80. In the illustrated configuration, each actuator 160, 170, 180 and slide 162, 172, 172 corresponds to a direction of movement X, Y, and Z. In non-illustrated configurations, the head assembly 70 may include less or more directions of movement, and/or such directions may or may not be orthogonal to one another. Each of the actuators 160, 170, 180 may include a corresponding connector 164, 174, and 184. The connectors 164, 174, 184 may be configured to couple the actuators 160, 170, 180 to other portions of the head assembly 70. The connectors 164, 174, 184 may be electronic connectors configured to transmit data, power and/or control signals. The connectors 164, 174, 184 may transmit power and/or control signals to drive and/or operate the actuators 160, 170, 180 to move portions of the head assembly 70 with respect to the interface assembly 80. The head assembly 70 may include stops corresponding with each of the directions of movement to limit the movement of the portions of the head assembly 70 with respect to the interface assembly 80.

In the illustrated configuration, portions of the head assembly 70 actuate in three linear directions of movement. In other configurations, the head assembly 70 may actuate in any suitable directions of movement, and such directions of movement may not be linear (e.g., rotational, angular, non-linear, etc.). In some configurations, the head assembly 70 may include mirrors that may be rotated and/or actuated to deflect optical beams rather than moving other portions of the head assembly 70.

The head assembly 70 may include an electronic assembly 114 with a controller configured to control the operation of at least a portion of the system 10. The electronic assembly 114 may be configured to distribute power and/or control signals to other components of the head assembly 70. The electronic assembly 114 may be configured to receive data signals from other components of the head assembly 70, such as the sensor 106.

Specifically, the electronic assembly 114 may include one or more connectors 116 configured to couple the electronic assembly 114 to other portions of the head assembly 70. The connector 116 may be electronic connector configured to transmit data, power and/or control signals. The connector 116 may be coupled to other portions of the head assembly 70, such as the sensor 106, the actuators 160, 170, 180 and/or other components. Additionally or alternatively, the connector 116 may be coupled to other portions of the system 40.

The electronic assembly 114 may include a processor that executes instructions stored in memory. As illustrated, the electronic assembly 114 may be incorporated into the head assembly 70. In other configurations, the electronic assembly 114 may be a separate component external to the head assembly 70. For example, the head assembly 70 may be controlled and/or operated by a computer system coupled to the head assembly 70. The electronic assembly 114 can include executable instructions that control the operation of the head assembly 70. For example, the electronic assembly 114 can include instructions that when executed cause the head assembly 70 to analyze and/or scan one or more samples.

The head assembly 70 may include an electronic assembly 126, which in some configurations may be a temperature management assembly configured to manage the temperature of portions of the head assembly 70. For example, the electronic assembly 126 may be configured to cool portions of the head assembly 70. The electronic assembly 126 may include a Peltier device, Peltier heat pump, solid state refrigerator, and/or a thermoelectric cooler. The electronic assembly 126 may include a controller configured to manage the temperature of portions of the head assembly 70 by controlling the operation of a Peltier device, Peltier heat pump, solid state refrigerator, and/or a thermoelectric cooler.

As illustrated for example in FIG. 3F, the head assembly 70 may include an emitter 132 configured to emit radiation to analyze samples. The emitter 132 may emit any suitable electromagnetic radiation to analyze and/or process samples. For example, the emitter 132 may emit visible light, ultraviolet light, X-rays, infrared or any other suitable radiation. In some configurations, the emitter 132 may be a laser or diode. In some configurations, the emitter 132 may be a Raman laser source. As illustrated, the emitter 132 may be free-space optically coupled to other portions of the head assembly 70. The emitter 132 may be optically coupled with the optical multiplexer 104. In such configurations, the optical multiplexer 104 may be configured to convey, direct, collimate and/or focus electromagnetic radiation from the emitter 132. For example, the optical multiplexer 104 and/or other optical components may be configured to direct radiation from the emitter 132 to a sample, for example, through the window 84.

In addition to or as an alternative to the emitter 132, the head assembly 70 may include an optical interface 128 configured to optically couple the head assembly 70 to other components of the system 40. For example, the optical interface 128 may couple the head assembly 70 to an emitter, such as the emitter assembly 62 as described above with respect to FIGS. 2C and 2E. The optical interface 128 may optically couple the head assembly 70 to the emitter assembly 62 via, for example, an optical cable (not illustrated). The emitter assembly 62 may be configured to transmit electromagnetic radiation to the head assembly 70. In such configurations, the optical multiplexer 104 may be configured to convey, direct, collimate and/or focus electromagnetic radiation from the emitter assembly 62. For example, the optical multiplexer 104 may be configured to direct radiation from the emitter assembly 62 to a sample.

For the sake of illustration, the system 40 includes multiple emitters, such as the emitter 132 and/or the emitter assembly 62. In other implementations, the system 40 may include either the emitter 132 or the emitter assembly 62, but not both. Such configurations may be implemented when dual emitters of certain types may not be necessary or desirable.

The head assembly 70 may include a second optical interface 130 configured to optically couple the head assembly 70 to other components of the system 40. For example, the optical interface 130 may couple the head assembly 70 to a detector, such as the detector assembly 64 as illustrated and described with respect to FIGS. 2C and 2E, for example. The optical interface 130 may optically couple the head assembly 70 to the detector assembly 64 via, for example, an optical cable (not illustrated). The detector assembly 64 may be configured to receive radiation from the head assembly 70 to obtain information about samples. In such configurations, the optical multiplexer 104 may be configured to convey, direct, collimate and/or focus electromagnetic radiation to the detector assembly 64. For example, the optical multiplexer 104 may be configured to distribute radiation from samples to the detector assembly 64.

The head assembly 70 may include one or more support members 134, 136, 138, 140 configured to support, enclose, and/or couple portions of the head assembly 70 to one another. The configuration of the support members 134, 136, 138, 140 may permit portions of the head assembly 70 to move in the X, Y, and Z directions. Additionally or alternatively, the configuration of the support members 134, 136, 138, 140 may limit the range of motion of portions of the head assembly 70 in the X, Y, and Z directions.

The head assembly 70 may include one or more heat sinks 120, 122, 124 configured to facilitate cooling of portions of the head assembly 70. In some configurations, the heat sinks 120, 122, 124 may be configured to cool specific components of the head assembly 70. For example, in the illustrated configuration, the heat sink 120 is configured to cool the emitter 132, the heat sink 122 is configured to cool the sensor 106 and the heat sink 124 is configured to cool the electronic assembly 126 or other portions of the head assembly 70. In other configurations, the head assembly 70 may include more or less heat sinks; the heat sinks 120, 122, 124 may be configured in other manners; or may be omitted entirely. Additionally or alternatively, the temperature of the components of the head assembly 70 may be managed by other temperature control systems and/or mechanisms.

In some configurations, the head assembly 70 may include any suitable aspects as described with respect to the system 10 of FIG. 1.

FIGS. 4A and 4B illustrate one example embodiment of the interface assembly, denoted generally at 80, in further detail. The interface assembly 80 may be configured to interface with other portions of the system 40, such as the head assembly 70 and/or other components of the system 40 that will be described in further detail below. As illustrated, the body 82 of the interface assembly 80 defines an aperture 86 extending at least partially through the interface assembly 80. The aperture 86 may be configured (e.g. shaped and/or dimensioned) to permit electromagnetic radiation to travel through at least a portion of the interface assembly 80 to the window 84. The window 84 may be at least partially transparent or translucent and/or may be configured to convey, direct, collimate and/or focus light travelling through the interface assembly 80.

As illustrated for example in FIG. 4B, the body 82 of the interface assembly 80 may define a receptacle 88 with an optoelectronic assembly 90 positioned therein. The optoelectronic assembly 90 will be described in further detail below with respect to FIGS. 5A-5B. The optoelectronic assembly 90 may be removably or non-removably fastened to the body 82 of the interface assembly 80 inside of the receptacle 88. The optoelectronic assembly 90 may include a body 92 and a connector 94 coupled to the body 92. In some configurations, the body 92 may be an electronic board such as a printed circuit board (PCB). The connector 94 may be configured to couple the optoelectronic assembly 90 to other portions of the system 40. The body 92 may include an opening further defining the aperture 86 of the interface assembly 80.

Turning to FIGS. 5A and 5B, the optoelectronic assembly 90 will be described in further detail. As illustrated, the optoelectronic assembly 90 may include one or more emitters 96 positioned around the aperture 86. One or more polarizers 98 may be positioned between each of the emitter 96 and the aperture 86. The emitters 96 may be configured to emit visible light, ultraviolet light, X-rays, infrared or any other suitable radiation. The emitter 96 may be any suitable electromagnetic radiation source. In some configurations, the emitter 96 may be a laser or a diode. In some configurations, the optoelectronic assembly 90 may include multiple emitters 96 and one or more of the emitters 96 may be configured to output electromagnetic radiation of different characteristics from one another. The emitters 96 may be electrically coupled to the connector 94 by any suitable electrical coupling. For example, the emitters 96 may be electrically coupled to the connector 94 by conductive traces printed on the body 92 or running through the body 92. The connector 94 may be coupled to other portions of the system 40. The connector 94 may permit power and/or control signals to be transmitted to the emitters 96. The connector 94 may also permit feedback and/or data to be transmitted from the optoelectronic assembly 90 to other portions of the system 40.

As illustrated for example in FIG. 5A, a heat conductive material 99 may be coupled to the body 92. The heat conductive material 99 may be configured to facilitate managing the temperature of the optoelectronic assembly 90 and/or the interface assembly 80. For example, the heat conductive material 99 may permit heat to be dissipated from portions of the optoelectronic assembly 90 and/or the interface assembly 80. Specifically, heat generated during operation of the emitters 96 may be conducted through the heat conductive material 99 and may dissipate away from the emitters 96. Additionally or alternatively, the heat conductive material 99 may dissipate heat from the polarizers 98 and/or other portions of the interface assembly 80. In some configurations, the heat conductive material 99 may be copper or may at least partially include copper.

FIG. 5C illustrates a cross-sectional view of the interface assembly 80 with the optoelectronic assembly 90. In operation, a sample may be positioned over the window 84 and the head assembly 70 may be activated to analyze and/or process the sample. In some configurations, the window 84 may be sealed to the body 82 such that substances may not travel between the window 84 and the body 82 at their interface. For example, the interface assembly 80 may include a seal such as an O-ring between the window 84 and the body 82. The window 84 and/or the aperture 86 may permit light to travel through the interface assembly 80, for example, between the sample and the objective 102 of the head assembly 70. The optoelectronic assembly 90 may be coupled to the body 82 such that the objective 102 of the head assembly 70 is a specified distance or range of distances from the optoelectronic assembly 90.

FIGS. 6A-6C illustrate the system 40 with different example configurations to process samples of different types and/or by different methods or techniques. FIG. 6A illustrates the system 40 with a device 200 configured to analyze one or more samples positioned in a sample tray. FIG. 6B illustrates the system 40 with a device 300 configured to analyze layers of samples, for example pills, tablets, capsules, medication, pellets, and/or other substances. FIG. 6C illustrates the system 40 with a device 400 configured to analyze particle samples such as powders, granules, and/or other substances. The system 40 may also be configured to analyze fluid samples such as liquids, gels, gases, and/or other substances, for example, as described in further detail below with respect to FIGS. 8A-8F. In such configurations, the system 40 may include an interface assembly 80 adapted to receive, deliver, process and/or analyze liquids, gels, gases, and/or other substances.

As mentioned above, the system 40 may be modular to permit the system 40 to be configured to analyze or process different types of samples. Additionally or alternatively, the system 40 may be modular to permit the system 40 to be configured to analyze or process samples by one or more different methods or techniques. Specifically, the interface assembly 80 may interface with modular components and/or devices. The modular components and/or devices may be configured to process, prepare and/or deliver analytes or samples over the window 84 to be analyzed by the system 40. The modular components and/or devices may include configurations suited for processing a specific type of sample or analyzing samples by a specific method or process. Additionally or alternatively, the modular components and/or devices may be configured to process samples either before or after they are analyzed, or both. For example, the modular components and/or devices may prepare the samples to be analyzed by the system 40. In another example, the modular components and/or devices may sort and/or separate samples after the samples are analyzed, for example, based on information obtained when the samples were analyzed.

Turning to FIGS. 7A-7D, the device 200 will be described in further detail. FIG. 7A illustrates a perspective view of the device 200. As illustrated, the device 200 may include a tray holder 208 configured to receive a sample tray 204. The sample tray 204 may include one or more wells 206 configured to receive a sample. The sample tray 204 may be configured to permit electromagnetic radiation to travel through the sample tray 204 to samples positioned inside of the wells 206. For example, at least a portion of the sample tray 204 may be at least partially transparent or translucent. In the illustrated configuration, the sample tray 204 includes ninety-six (96) of the wells 206, although only one is labeled in the Figures for clarity. In some configurations, the tray holder 208 may receive sample trays with a standardized configuration (e.g., shape, dimensions, number of wells, etc.).

The sample tray 204 may be removably positioned inside of the tray holder 208 so one or more samples may be analyzed by the system 40. In the illustrated configuration, the device 200 is configured to move the sample tray 204 along two axes C and D. The device 200 may move the sample tray 204 along the axes C and D so that each of the wells 206 may be analyzed, as will be described in further detail below. In other configurations, the device 200 may be configured to move the sample tray 204 along more or less than the two axes C and D, and such axes may or may not be orthogonal to one another.

The device 200 may include a housing 202 surrounding at least a portion of the device 200. The tray holder 208 may be coupled to or integrally formed with a first member 214 that may be configured to move with respect to the housing 202 along axis C. The first member 214 may be movably and/or slidingly coupled to a second member 216 that may be configured to move with respect to the housing 202 along axis D. The configuration of the first member 214 and the second member 216 may permit the sample tray 204 to be moved along one or both of the axes C and D.

FIG. 7B illustrates a perspective view of the device 200 with the housing 202 not shown. As illustrated for example in FIG. 7B, the device 200 may include one or more linear actuators or motors 260, 270. If the motors 260, 270 are rotational motors, each of the motors 260, 270 may be coupled to a corresponding lead screw 262, 272 configured to translate rotational motion to linear motion. If the motors 260, 270 are configured to convey linear motion, the lead screws 262, 272 may be shafts, coupling members, and/or omitted altogether. As illustrated, the lead screw 272 may be coupled to the first member 214 such that the motor 270 can drive the first member 214 along the axis C. The lead screw 262 may be coupled to the second member 216 such that the motor 260 can drive the second member 216 along the axis D.

The device 200 may include an electronic assembly 210 with one or more connectors 212. The electronic assembly 210 may include a controller configured to control the operation of at least a portion of the device 200. The connector 212 may be an electronic connector configured to transmit data, power, feedback and/or control signals. In some configurations, the connector 212 may be coupled to the connector 46 and/or the connector 48 of the system 40. The electronic assembly 210 may include connectors electrically coupled to corresponding connectors of the motors 260, 270 (not illustrated). The electronic assembly 210 may be configured to distribute power and/or control signals to other components of the device 200, such as the motors 260, 270. The electronic assembly 210 may be configured to receive data signals and/or feedback from the motors 260, 270. The electronic assembly 210 may be configured to receive power and/or control signals from other portions of the system 40, and/or may distribute such power and/or control signals to portions of the device 200.

The device 200 may include stops corresponding with each axis of movement to limit the movement of portions of the device 200 such as the first member 214, the second member 216, the tray holder 208 and/or the sample tray 204.

The electronic assembly 210 may include a processor that executes instructions stored in memory. As illustrated, the electronic assembly 210 may be incorporated into the device 200. In other configurations, the electronic assembly 210 may be positioned as a separate component external to the device 200. For example, the device 200 may be controlled and/or operated by a computer system coupled to the device 200. The electronic assembly 210 can include executable instructions that control the operation of the device 200. For example, the electronic assembly 210 can include instructions that when executed cause the device 200 to move the tray holder 208 and/or the sample tray 204 to analyze and/or scan one or more samples positioned inside of the wells 206. In some configurations, the samples may be analyzed and/or scanned individually. In other configurations, samples inside of more than one of the wells 206 may be analyzed simultaneously.

FIG. 7C illustrates a bottom perspective view and FIG. 7D illustrates a top view of the device 200. As illustrated, the device 200 may be coupled to an objective such as the objective 102 of the head assembly 70. The objective 102 may include any of the features described with respect to the objective 102 of the head assembly 70 and/or may be adapted to operate with the device 200. As illustrated, when the device 200 is included in the system 40, interface assemblies such as the interface assembly 80 may be omitted and the device 200 may be directly optically coupled to the objective 102 of the head assembly 70. In other configurations, interface assemblies such as the interface assembly 80 may be included between the objective 102 and the device 200.

The objective 102 may be configured to analyze and/or process samples in the wells 206 of the sample tray 204. Specifically, the objective 102 may be configured to transmit and/or receive electromagnetic radiation travelling between the head assembly 70 and samples positioned inside of the wells 206 of the sample tray 204. The sample tray 204 may be moved in the C and/or D directions with respect to the objective 102 to change which of the wells 206 of the sample tray 204 are being scanned and/or analyzed. Additionally or alternatively, the movement of the sample tray 204 in the C and/or D directions may contribute to the scanning and/or analyzing of the samples by the head assembly 70.

In addition to or as an alternative to the movement of the sample tray 204, the objective 102 may be moved in the Z and or X directions (see for example FIG. 3C) by the head assembly 70 to scan and/or analyze samples inside of one or more wells 206 of the sample tray 204. The objective 102 may be moved in the Y direction (see for example FIG. 3C) by the head assembly 70 to focus electromagnetic radiation travelling between the head assembly 70 and samples positioned inside of the wells 206.

In some configurations, the device 200 may include an enclosure (not illustrated) covering at least a portion of the device 200. The enclosure may include an open and a closed position. In the closed position, the enclosure may at least partially or entirely isolate the device 200 from electromagnetic radiation external to the system 40. For example, the enclosure may block light external to the system 40.

In further configurations, the device 200 may include one or more emitters configured to emit radiation incidenting the sample tray 204 and/or the samples in the wells 206. For example, the emitters may be included with the enclosure and/or the tray holder 208. Additionally or alternatively, emitters may be coupled to and/or positioned around the objective 102. The emitters may include any suitable aspects of any of the emitters described in this disclosure.

In further configurations, the device 200 may be environmentally controlled. For example, the temperature, pressure, and/or other characteristics surrounding the sample tray 204 and/or the samples in the wells 206 may be controlled. Such configurations may be used to analyze organic matter (e.g., cells, proteins, etc.) without damaging the analytes.

FIGS. 8A-8D illustrate a sample positioned on the window 84. FIGS. 8A-8D may be visual representations of data obtained during analysis and/or processing of a sample by the head assembly 70. Additionally or alternatively, FIGS. 8A-8D may represent visible light images of a sample on the window 84. Additionally or alternatively, FIGS. 8A-8D may represent data obtained by way of imaging by electromagnetic radiation that is different than visible light radiation. With attention to FIGS. 8A-8D, a method of analyzing and/or processing a sample will be described in further detail.

As illustrated in FIG. 8A, a sample may include a plurality of particles. In some circumstances, the particles may include different characteristics from one another. For example, the particles may include different dimensions, shapes, chemical composition, etc. Data obtained during analysis of the sample may be used to distinguish different particles based on their characteristics. The data may be used to identify various components of the sample. In some circumstances, the sample may include contaminants that may be identified based on the data.

A method of analyzing and/or processing a sample may include scanning the sample using a first scanning method with a first electromagnetic radiation. In some configurations, the first electromagnetic radiation may be visible light resulting in analyzed data representing an image. FIG. 8A illustrates a representation of a sample with the first particle 470 that may be obtained using the first scanning method with the first electromagnetic radiation. The particle 470 may be any component of a sample, but in some circumstances the particle 470 may represent a contaminant or area of interest of a sample. Using the data obtained by the first scanning method with the first electromagnetic radiation, one or more contaminants and/or areas of interest of a sample may be identified. Identification may include the position and/or other characteristics of the contaminants and/or areas of interest.

After the contaminants and/or areas of interest (e.g., the particle 470, etc.) are identified, a second scanning method with a second electromagnetic radiation may be used to analyze and/or process the sample. In some configurations, the second scanning method may be Raman spectroscopy.

The second scanning method with the second electromagnetic radiation may be configured based on data obtained by the first scanning method with the first electromagnetic radiation. For example, as represented in FIG. 8B, the second scanning method may be configured such that certain portions of the sample (e.g., the particle 470, etc.) are not scanned. The portions of the sample that are not scanned may correspond with contaminants and/or areas of interest.

Additionally or alternatively, as represented in FIG. 8C, the second scanning method may be configured such that only certain portions of the sample (e.g., the particle 470, etc.) are scanned. The portions of the sample that are scanned may correspond with contaminants and/or areas of interest. The second scanning method may alter and/or modulate the characteristics of the sample. For example, the second electromagnetic radiation may burn or otherwise alter contaminants such as the particle 470.

Additionally or alternatively, as represented in FIG. 8D, the second scanning method may be configured such that certain portions of the sample (e.g., the particle 470, etc.) are scanned with electromagnetic radiation with different characteristics.

In some configurations, a method of analyzing and/or processing a sample may include imaging a sample with electromagnetic radiation such as visible light and/or ultraviolet light. The method of analyzing and/or processing the sample may include analyzing the sample with Raman spectroscopy after imaging the sample. The method of analyzing and/or processing the sample may include configuring the Raman spectroscopy analyzation after imaging the sample and/or before Raman spectroscopy analyzation. Configuring the Raman spectroscopy analyzation may include identifying contaminants and/or areas of interest based on data obtained from imaging the sample. Configuring the Raman spectroscopy analyzation may include selecting portions of the sample to be analyzed by Raman spectroscopy and/or selecting portions of the sample not to be analyzed by Raman spectroscopy. Configuring the Raman spectroscopy analyzation may include selecting first portions of the sample to be analyzed by Raman spectroscopy of a first characteristic (e.g., power level, resolution, etc.) and/or selecting second portions of the sample different than the first portions to be analyzed by Raman spectroscopy of a second characteristic (e.g., power level, resolution, etc.). The method of analyzing and/or processing the sample may include analyzing the sample with Raman spectroscopy based on the configuration of the Raman spectroscopy analyzation.

In some configurations, a sample may include organic matter such as cells. In some circumstances, a sample may include cells overlapping one another with respect to the window 84. In some circumstances, the overlapping cells may inhibit analyzing and/or processing the sample at the overlapping portion. One or more overlapping portions of cells may be identified, for example, using visible light, ultraviolet light and/or other analyzation methods. One or more overlapping portions may be selected not to be scanned as illustrated and described with respect to FIG. 8B. Specifically, the overlapping portions may not be scanned because a good signal may not be obtained with Raman spectroscopy analyzation and/or other analyzation methods. One or more of the scanning methods described above may be configured not to scan the overlapping portions.

In some configurations where the sample includes, for example, organic matter such as cells, the method of analyzing and/or processing the sample may include identifying areas of interest, such as components of the cell and/or other organic matter (e.g., nucleus, cytosol, proteins, etc.). The areas if interest may be identified, for example, using visible light, ultraviolet light and/or other analyzation methods.

In some configurations, the images and/or data obtained from the visible light, ultraviolet light and/or other analyzation methods may be used to identify one or more portions and/or components of one or more cells. The identified portions and/or components may be used to automatically and/or manually configure a scanning method to keep one or more of the cells viable. For example, the characteristics of the scanning method, such as the power of electromagnetic radiation, may be automatically or manually selected for the identified portions and/or components such that components of the one or more of the cells are not destroyed. In such configurations, the entire sample may be scanned, but with different characteristics of the scanning method, for example, as illustrated and described with respect to FIG. 8D above.

In some configurations, a method of analyzing and/or processing a sample may include identifying cells in wells of a sample tray. The method of analyzing and/or processing a sample may include identifying an amount of suitable and/or desired targets. The targets may selected based on any suitable characteristics, for example: the amount of occlusion of the cells by other cells; and/or the visibility of components of the cells such as the nucleus; and/or portions of the cells that are blocked by substances such as feeding media. The method of analyzing and/or processing a sample may include automatically or manually generating a database of targets. The database of targets may include X, Y and Z coordinates for the target cells and/or components of the target cells such as the nucleus, the cytosol, and/or the membrane. The method of analyzing and/or processing a sample may include configuring a scanning method to scan the target cells and/or components of the target cells. For example, a Raman spectroscopy scan may be configured to scan the target cells and/or components of the target cells. The data from the scanning method (e.g., the Raman spectroscopy scan) may be used to automatically or manually identify protein and/or the lipid expression for the scanned portions.

Additionally or alternatively, data from the scanning method (e.g., the Raman spectroscopy scan) may be used to automatically or manually determine trends and/or characteristics of a cell population. For example, data from a first scan may be compared to one or more subsequent scans at one or more of the same positions to determine trends and/or characteristics of a cell population. For example, data from a first scan may be compared to one or more subsequent scans (for example, in a subsequent hour and/or two hours) to determine the health of a cell population.

With reference to FIG. 9, a method 900 method of analyzing and/or processing a sample will be described in further detail. In some configurations, the method 900 may be implemented by the system 40. It should be appreciated that the method 900 may be implemented in other manners and/or with other embodiments. As illustrated for example in FIG. 9, the example method 900 may include a step 910 of scanning the sample using a first scanning method with a first electromagnetic radiation. The method 900 may include a step 920 of identifying one or more contaminants and/or areas of interest of a sample. The method 900 may include a step 930 of scanning the sample using a second scanning method with a second electromagnetic radiation based on the position of the contaminants and/or areas of interest. The method 900 may include any suitable aspects described above.

FIGS. 10A-10E illustrate a device 500 that may be used as part of the system 40 in configurations for analyzing fluid samples such as liquids, gels, gases, and/or other fluidic substances. In some configurations, the device 500 may be used instead of the interface assembly 80. The device 500 may include any suitable aspects as described with respect to the interface assembly 80. A description of some similar and/or same aspects of the device 500 may not be included for brevity.

FIGS. 10A and 10B are perspective views of the device 500. As illustrated, the device 500 may include a first body portion 502 and a second body portion 504. The device 500 includes a window 584 that is configured to permit light to travel through at least a portion of the device 500. The window 584 may be at least partially transparent or translucent and/or may be configured to convey, direct, collimate and/or focus light travelling through the device 500.

The device 500 may be configured to interface with other portions of the system 40, such as the head assembly 70 and/or other components of the system 40 described above. As illustrated, the first and second body portions 502, 504 may define an aperture 586 extending at least partially through the device 500. The aperture 586 may be configured (e.g. shaped and/or dimensioned) to permit electromagnetic radiation to travel through at least a portion of the device 500 to the window 584.

As illustrated for example in FIG. 10B, the second body portion 504 may define a receptacle 588 with an optoelectronic assembly such as the optoelectronic assembly 90 positioned therein. The optoelectronic assembly 90 is described in further detail above, for example, in descriptions associated with FIGS. 5A and 5B. The optoelectronic assembly 90 may be removably or non-removably fastened to the device 500 inside of the receptacle 588.

As illustrated, the device 500 may include an inlet 510 and an outlet 514 which may be positioned on the second body portion 504. The inlet 510 and the second body portion 504 may define an inlet conduit 512 configured to permit fluid (e.g., liquids and/or gases) to enter the device 500. The outlet 514 and the second body portion 504 may define an outlet conduit 516 configured to permit fluid (e.g., liquids and/or gases) to exit the device 500. In some circumstances, the gaseous or liquid fluid may include solid substances and/or particles.

FIG. 10C illustrates a cross sectional view of the device 500 and FIG. 10D illustrates a cross sectional view of a portion of the device 500. The window 584 may be positioned between the first and second body portions 502, 504. The device 500 may include a seal 506 configured to seal the window 584. The seal 506 may be an O-ring.

In some configurations, the seal 506 may contribute to forming an interface between the window 584 and/or the first and second body portions 502, 504 such that fluid may not pass. A chamber 518 may be defined between the window 584 and a second window 520 occluding the aperture 586.

The windows 520, 584 may be each positioned at least partially inside the aperture 586 and may define the chamber 518 within the aperture 586 between the windows 520, 584. The windows 520, 584 may occlude the aperture 586 and may permit light to travel through the device 500, for example, between the fluid sample and the objective 102 of the head assembly 70. The optoelectronic assembly 90 may be coupled to the device 500 such that the objective 102 of the head assembly 70 is a specified distance or range of distances from the optoelectronic assembly 90. Additionally or alternatively, the device 500 may be configured such that the chamber 518 is dimensioned and/or shaped to analyze as specific volume of the fluid sample.

In operation, a sample fluid may be directed into the chamber 518 and over the window 520 such that the head assembly 70 may analyze and/or process the fluid sample. The head assembly 70 may be activated and the fluid sample may be analyzed and/or processed. The fluid sample may be continuously or incremental analyzed and/or processed. For example, in some configurations the fluid sample may be continuously analyzed as it flows through the device 500. In other configurations, flow of the fluid sample may be stopped at a position over the window 520 and fluid sample may be incrementally analyzed. In such configurations, the device 500 may include one or more valves or other aspects to segment portions of the fluid sample.

In some configurations, the device 500 and/or the system 40 may include dynamic light scattering analysis. An example of the device 500 and/or the system 40 that includes dynamic light scattering analysis is illustrated in FIG. 10E.

In such configurations, the device 500 may be coupled to a peristaltic pump 530, as illustrated. Additionally or alternatively, the system 40 may include a conduit and/or an assembly 532 with plurality of conduits 534 a-d coupled to the device 500. The plurality of conduits 534 a-d may include conduits 534 a-d of different dimensions that may be selected to correspond to the density of the particles in the gaseous or the liquid fluid. A corresponding one of the conduits 534 a-d may be selected for particles of a specific density.

FIG. 10F illustrates a corresponding conduit 534. The system 40 may include a plurality of emitters 536 a-d that may be positioned around the conduit 534. The emitters 536 a-d may direct light through the conduit 534 to analyze the particles in the gaseous or the liquid fluid. Specifically, the system 40 may analyze reflections and/or scintillations from particles in a gaseous or liquid fluid (e.g., solution, air, etc.) to obtain data. The data may include an angular and/or time varying signal signals. The frequency of the signals may be compared to the angle of the signals to determine information regarding the characteristics of the particles in the gaseous or the liquid fluid, such as dimensions and/or shape.

FIGS. 11A and 11B illustrate alternative embodiments of systems that may be configured to be used as a part of production line to analyze and process samples to obtain information about aspects of the production line, such as characteristics of the finished products or intermediaries of the products. The systems may be implemented as an in-process monitoring systems integrated into a production line and configured to analyze one or more properties of a sample as it is being produced. Any or all aspects described above with respect to system 40 may be incorporated into the systems of FIGS. 11A and 11B. Additionally or alternatively, the systems of FIGS. 11A and 11B may include any suitable aspects described in U.S. patent application Ser. No. 14/507,637, entitled “OPTICAL AND CHEMICAL ANALYTICAL SYSTEMS AND METHODS” and U.S. patent application Ser. No. 14/454,483, entitled “ANALYSIS AND PURGING OF MATERIALS IN MANUFACTURING PROCESSES,” which are both incorporated by reference in their entirety.

FIG. 12A illustrates an analysis configuration 600 that may be used, for example, in immersion microscopy. As illustrated, the analysis configuration 600 may include an objective 602 configured to analyze a sample 606 through a window 604. The window 604 may be a coverslip, a portion of a well plate, or any of the windows described in this disclosure.

As illustrated, a layer of immersion oil 608 is positioned between the objective 602 and the window 604. The immersion oil 608 may be configured to direct and/or focus electromagnetic radiation travelling between the objective 602 and the window 604. The immersion oil 608 may be retained by characteristics of the immersion oil 608 such as surface tension. In such configurations, if the objective 602 is moved, for example in the X or Y directions as illustrated, the surface tension of the immersion oil 608 may be broken and the immersion oil 608 may leave the position between the objective 602 and the window 604.

In the analysis configurations 600, if the objective 602 is to analyze more than one sample, such as the sample 606, the immersion oil 608 may be removed and the objective 602 and/or the window 604 may require cleaning to remove the oil and/or contaminants. In such configurations, the immersion oil 608 may then be manually reapplied between the objective 602 and the window 604. For example, if the window 604 is part of a well plate, the immersion oil 608 may be removed and reapplied to analyze more than one sample of the well plate.

FIG. 12B illustrates an analysis configuration 610 that may be used, for example, as an alternative to the analysis configuration 600. As illustrated, the analysis configuration 610 includes a deformable member 614 including a membrane 618 defining a bladder filled with a gel or a fluid 616 (although fluid 616 will be used in the following description, the fluid 616 may be a gel). The deformable member 614 may be capable of being deformed by the objective 602 and/or the window 604. The deformable member 614 may be capable of being deformed to correspond with at least one surface of the objective 602 and/or at least one surface the window 604. As illustrated, the deformable member 614 may deform to generally correspond with the shape of the space between the objective 602 and/or the window 604. The deformable member 614 may be at least partially transparent or translucent and/or may be configured to convey, direct, collimate and/or focus light travelling between the objective 602 and the window 604. When the deformable member 614 deforms, it may continue to retain the fluid 616 inside of the membrane 618. Although the shape of the deformable member 614 may change, the volume of fluid 616 retained inside of the membrane 618 may be substantially constant. Additionally or alternatively, the deformable member 614 may elastic and/or resilient.

Although the membrane 618 and the fluid 616 may be formed of any suitable materials, in some configurations the membrane 618 may include a polymer such as a silicone. The membrane 618 may be a solid or semi-solid substance that is configured to enclose the fluid 616. In some configurations, the membrane 618 may be a solid or semi-solid silicone. In further configurations, the membrane 618 may be a vulcanized silicone. The fluid 616 may be liquid or gel substance that permits the deformable member 614 to deform. The fluid 616 may include an immersion fluid or a substance similar to an immersion fluid used in microscopy. In some configurations, the fluid 616 may be a liquid or gel polymer such as a silicone oil. Both the membrane 618 and the fluid 616 may be at least partially transparent or translucent and/or may be configured to convey, direct, collimate and/or focus light travelling between the objective 602 and the window 604.

As illustrated in FIGS. 12C and 12D, the deformable member 614 may permit the objective 602 to be moved at least in the X and the Y directions. Additionally or alternatively, the deformable member 614 may permit the objective 602 to be moved in the Z direction (not illustrated). As illustrated in FIGS. 12C and 12D, as the objective 602 is moved, the deformable member 614 may deform and adapt to the movement of the objective 602. In such configurations, the deformable member 614 may continue to convey, direct, collimate and/or focus light travelling between the objective 602 and the window 604 as the objective 602 is moved.

Unlike the analysis configuration 600 including the immersion oil 608, the deformable member 614 does not need to be replaced when the objective 602 is moved. Specifically, the fluid 616 is retained by the membrane 618 and thus the fluid 616 does not leave the position between the objective 602 and the window 604, for example, because of a loss of surface tension. Additionally or alternatively, the deformable member 614 may be cleaned, for example, to remove contaminants. In contrast, if immersion oil is used, it may be susceptible to fouling by contaminants and may need to be discarded.

As illustrated for example in FIG. 12D, the analysis configuration 610 may permit the objective 602 to be moved to analyze different portions of the sample 606. Additionally or alternatively, the analysis configuration 610 may permit the objective 602 to be moved to focus the analysis configuration 610.

In some configurations, the deformable member 614 may include at least one dimension between 0 and 500 microns, between 0 and 400 microns, between 100 and 200 microns, or any other range spanning and combination between 0 and 500 microns. In other configurations, the deformable member 614 may include at least one dimension greater than 500 microns.

In some configurations, forming the deformable member 614 may include forming a drop of liquid or gel substance. For example, the substance may be a liquid or gel polymer such as silicone. Forming the deformable member 614 may include processing the outside surface of the drop to form a coating that may form the membrane 618. Forming the deformable member 614 may include processing the outside surface of the drop to form a coating with a liquid or gel substance inside of the coating that may form the fluid 616.

In some configurations, forming the deformable member 614 may include vulcanizing an outer portion of the drop to form the membrane 618 with the fluid 616 positioned inside. In other configurations, forming the deformable member 614 may include forming the membrane 618 by any suitable method and then positioning the fluid 616 inside of the membrane 618, for example, by injecting the fluid 616.

The configuration (e.g., shape, dimensions, etc.) of the deformable member 614 may be adapted to be used with any suitable window or analysis configurations. For example, the deformable member 614 may be configured to be used with any suitable aspects of the systems described above.

The deformable member 614 may permit either or both the objective 602 and/or the window 604 to break contact with the deformable member 614 without permitting the fluid from leaving a position between the objective 602 and the window 604. Such configurations may permit the objective 602 to be repositioned to other portions of the window 604 and/or to analyze other samples through other windows.

In some configurations, a system incorporating the analysis configuration 610 may be configured to automatically or manually remove the deformable member 614 and/or discard the deformable member 614 after analyzing one or more samples to facilitate in preventing contamination between samples. After the deformable member 614 is removed and/or discarded, the may be configured to automatically or manually position another deformable member, for example, over the objective 602 or other positions.

FIG. 12E illustrates another example of an analysis configuration 620. As illustrated, in some configurations, the analysis configuration 620 may include a sheet or array 622 of deformable members 614 a, 614 b, 614 c, etc. Each of the deformable members 614 a, 614 b, 614 c may include corresponding fluid 616 a, 616 b, 616 c retained by membranes 618 a, 618 b, 618 c.

As illustrated, the deformable members 614 a, 614 b, 614 c may be operably coupled to one another in the array 622. At least a portion of the array 622 with one of the deformable members 614 a, 614 b, 614 c, may be positioned between the objective 602 and the window 604 to permit the sample 606 to be analyzed. Once the sample 606 is analyzed, the objective 602 and/or the window 604 may be repositioned and a second one of the deformable members 614 a, 614 b, 614 c, may be positioned between the objective 602 and the window 604 to permit another sample to be analyzed. Such configurations may facilitate in preventing contamination between samples. System incorporating the analysis configuration 620 may be configured to automatically or manually reposition the array 622 and/or the deformable members 614 a, 614 b, 614 c, and/or discard one or more of the deformable members 614 a, 614 b, 614 c, after analyzing one or more samples.

FIGS. 12F and 12G illustrate another example of an analysis configuration 630. As illustrated, in some configurations, an objective 602 a may include a receptacle 632 configured to receive at least a portion of a deformable member 614 d. The deformable member 614 d may include a bladder defined by a membrane 618 d and the receptacle 632. As illustrated, the receptacle 632 and the membrane 618 d may cooperate to retain a fluid 616 d. In such configurations, the deformable member 614 d may be integrated with the objective 602 a. Such configurations of the objective 602 a and/or the deformable member 614 d may facilitate in retaining the deformable member 614 d with respect to the objective 602 a. The analysis configuration 630 c may include any suitable aspects and advantages described with respect to FIGS. 12A-12D.

As illustrated in FIG. 12G the deformable member 614 d may be positioned against the window 604 to analyze the sample 606. The deformable member 614 d may permit the objective 602 a to be moved at least in the X and the Y directions. Additionally or alternatively, the deformable member 614 d may permit the objective 602 a to be moved in the Z direction (not illustrated). As the objective 602 a is moved, the deformable member 614 d may deform and adapt to the movement of the objective 602 a. In such configurations, the deformable member 614 d may continue to convey, direct, collimate and/or focus light travelling between the objective 602 a and the window 604 as the objective 602 a is moved.

Unlike the analysis configuration 600 including the immersion oil 608, the deformable member 614 d does not need to be replaced when the objective 602 a is moved. Specifically, the fluid 616 d is retained by the membrane 618 d and thus the fluid 616 d does not leave the position between the objective 602 a and the window 604, for example, because of a loss of surface tension. Additionally or alternatively, the deformable member 614 d may be cleaned, for example, to remove contaminants. In contrast, if immersion oil is used, it may be susceptible to fouling by contaminants and may need to be discarded.

The analysis configuration 630 may permit the objective 602 a to be moved to analyze different portions of the sample 606. Additionally or alternatively, the analysis configuration 630 may permit the objective 602 a to be moved to focus the analysis configuration 630.

FIGS. 12H-12J illustrate another example of an array 650 that may include any or all suitable aspects described with respect to the array 622. As illustrated, the array 650 may be configured to be used with a sample tray such as the sample tray 204 described with respect to the device 200. As illustrated, the array 650 may include a body sized and shaped to correspond with the sample tray 204. The array 650 may include or be formed of a polymer such as a silicone. The array 650 may include or be formed of a solid or semi-solid substance. In some configurations, the array 650 may include or be formed of solid or semi-solid silicone. In further configurations, the array 650 may include or be formed of a vulcanized silicone.

As illustrated for example in FIG. 12I, the array 650 may include one or more lenses 652. As illustrated, the configuration (e.g., size, shape, positioning, amount) of the lenses 652 may correspond to the wells 206 of the sample tray 204. As illustrated, the lenses 652 may be configured (e.g., dimensioned and/or shaped) to convey, direct, collimate and/or focus light travelling between the objective 602 and the window 604. For example, the lenses 652 may be sized and/or shaped to be deformed between the objective 602 and the window 604 to convey, direct, collimate and/or focus light travelling between the objective 602 and the window 604.

The lenses 652 may include or be formed of a polymer such as a silicone. In some configurations, the lenses 652 may include or be formed of a solid or semi-solid substance. In other configurations, the lenses 652 may include or be formed of a fluid or gel substance. In some configurations, the lenses 652 may include or be formed of solid, semi-solid, fluid and/or gel silicone.

In some configurations, the lenses 652 may be formed on the surface of the array 650. For example, the surface of the array 650 may be sized and shaped to form the lenses 652. In another example, the lenses 652 may be formed by processing a liquid or gel substance, for example by vulcanization, to form a solid or semi-solid substance that define the array 650 and/or encloses a fluid, as described above with respect to FIGS. 12B-12D.

The array 650 and/or the lenses 652 may be deformable to permit the portions of the array 650 deform between window 604 and/or the objective 602. The array 650 and/or the lenses 652 may be configured to deform to correspond to surfaces of the window 604 and/or the objective 602. The array 650 and/or the lenses 652 may be at least partially transparent or translucent and/or may be configured to convey, direct, collimate and/or focus light travelling between the objective 602 and the window 604.

The system 40 may include any suitable configurations and/or combinations of configurations described above. The system 40 may be configured to include one or more aspects described with respect to the devices 200, 300, 400, and/or 500. One example configuration of the system 40 including aspects from more than one of the devices 200, 300, 400, and/or 500 will now be described in further detail.

In some configurations, the system 40 may include a reaction vessel or a crystallization tube and flow lines coming from different sections of the reaction vessel driven by a peristaltic pump that pumps fluid to the system 40. The flow lines may be coupled, for example, to a sample tray positioned in the device 200. The sample tray may include aspects similar to the sample tray 204, and may further include fluidic and/or microfluidic channels that permit the device 200 to analyze and/or process one or more fluid samples from the reaction vessel. The device 200 may be further coupled to an evacuation system configured to permit the fluid samples to be evacuated and/or purged from the device 200.

The evacuation system coupled to the device 200 may include any suitable aspects described above, for example: a compressor or a vacuum configured to generate negative pressure to evacuate and/or purge the fluid samples; a switch configured to selectively couple the vacuum to one or more vessels configured to retain portions of the fluid samples evacuated and/or purged from the device 200; and/or outlets coupled to the one or more of the vessels that may permit portions of the fluid samples in corresponding vessels to be continuously or incrementally removed from the vessels. The evacuation system coupled to the device 200 may be configured to aggregate and/or concentrate one or more components of the fluid samples in a manner similar to any of those described above. Specifically, the switch may be selectively coupled to one of the vessels to aggregate and/or concentrate one or more components of the fluid samples in that one of the vessels. The switch may be selectively coupled to one of the vessels based on data from analyzing the fluid samples by the head assembly 70 via the interface assembly 80 and the device 200.

In some configurations, the sample tray with fluidic and/or microfluidic channels may permit sample dissolution to be analyzed by the system 40. For example, the system 40 may be used to analyze one or more pills to determine dissolution characteristics such as rate and/or repeatability over a number of pills.

Aspects of the present disclosure may be embodied in other forms without departing from its spirit or characteristics. The described aspects are to be considered in all respects illustrative and not restrictive. All changes which come within the meaning and range of equivalency of the claims are to be embraced within their scope. 

What is claimed is:
 1. A system for analyzing a sample comprising: an objective; a window configured to receive a sample; a deformable member positioned between the window and the objective.
 2. The system of claim 1, wherein the deformable member is configured to deform when the objective is moved with respect to the window.
 3. The system of claim 1, wherein the deformable member is configured to conform to the shape of the objective when the objective is moved in three dimensions.
 4. The system of claim 1, wherein the deformable member is capable of deforming to permit the objective to move with respect to the window in at least two directions of movement.
 5. The system of claim 1, wherein the deformable member is configured to deform to a shape corresponding to a space between the objective and the window.
 6. The system of claim 1, wherein the deformable member is at least partially transparent or translucent to electromagnetic radiation.
 7. The system of claim 1, wherein the deformable member is inelastic.
 8. The system of claim 1, wherein the deformable member is elastic.
 9. The system of claim 1, wherein the deformable member comprises a bladder at least partially filled with a gel or a fluid.
 10. The system of claim 9, wherein the bladder comprises a membrane, wherein the membrane comprises vulcanized silicone.
 11. The system of claim 9, wherein the gel or fluid comprises silicone.
 12. The system of claim 1, wherein the objective is designed for silicone oil immersion.
 13. The system of claim 1, wherein the deformable member comprises at least one dimension between 0 microns and 500 microns.
 14. The system of claim 1, wherein the deformable member comprises at least one dimension greater than 500 microns.
 15. The system of claim 1, wherein the system comprises a plurality of deformable members.
 16. The system of claim 15, wherein the plurality of deformable members is configured in an array.
 17. The system of claim 1, further comprising a receptacle for retaining the deformable member. 